Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

ABSTRACT

A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

This is a Continuation of application Ser. No. 14/560,556 filed Dec. 4,2014, which is a Division of application Ser. No. 14/452,971 filed Aug.6, 2014, which is a Division of application Ser. No. 13/879,237 filedApr. 26, 2013, which is a PCT National Phase Application ofPCT/JP2011/075091 which claims the benefit of Japanese application JP2010-246681, filed Nov. 2, 2010, and Japanese application JP2010-250959, filed Nov. 9, 2010, the content of each of which is herebyincorporated by reference into this application.

TECHNICAL FIELD

The present invention relates to a lead frame for mounting LED elements,a lead frame with a resin, a method for manufacturing semiconductordevices, and a lead frame for mounting semiconductor elements.

BACKGROUND ART

The product described in JP-A-2001-326316, for example, exists as aconventional lead frame for resin-sealed semiconductor devices. Inconventional lead frames such as this one, a large number of terminalsare arranged around each of die pads, with tie bars being arranged ingrid form on a plane in order to interconnect the large number ofterminals to hanging leads.

Meanwhile, illumination devices that each use light-emitting diode (LED)elements as a light source are used in recent years in generalillumination, vehicle-mounted illumination, and displays, as well as instate indicators of various electrical household appliances, officeautomation machines and apparatuses, and vehicular devices. Some ofthese types of illumination devices include a semiconductor devicefabricated by mounting LED elements in a lead frame.

PRIOR ART LITERATURE Patent Documents

Patent Document 1: JP-A-2001-326316

Some of the semiconductor devices for LED elements or of thesemiconductor devices for discrete semiconductor elements have die pads,which are arranged linearly in one row along with leads arranged aroundeach of the die pads. Lead frames for these semiconductor devices,unlike the foregoing conventional lead frame, can be manufactured moreefficiently by interconnecting mutually adjacent die pads and leadswithout providing tie bars in grid form on a plane, since the number ofelements to be surface-mounted in one lead frame can be correspondinglyincreased.

In this case, the die pads and the leads need to be spaced apart fromone another to prevent short-circuiting. A problem could therefore occurthat if spatial gaps between the die pads and the leads becomeconnected, this causes a plurality of elongated spaces parallel to oneside of the lead frame. The occurrence of this problem might lead to thelead frame being formed into a slit blind/screen or interdigitated shapeand becoming deformed during handling.

The present invention has been made with these circumstances taken intoaccount, and an object of the invention is to provide a lead frame formounting LED elements, a lead frame with a resin, a method formanufacturing a semiconductor device, and a lead frame for mountingsemiconductor elements. Each of the lead frames and the manufacturingmethod are designed so as to prevent a spatial gap between a die pad anda lead from becoming connected, thus an elongated space from beingformed in the lead frame, and hence the lead frame from being formedinto a slit blind/screen or interdigitated shape and from becomingdeformed during handling.

DISCLOSURE OF THE INVENTION

A lead frame for mounting LED elements, according to the presentinvention, includes: a frame body region; and a large number of packageregions arranged in multiple rows and columns in the frame body region,the package regions each including a die pad on which an LED element isto be mounted and a lead section adjacent to the die pad, the packageregions being further constructed to be interconnected via a dicingregion. The die pad in one package region and the lead section inanother package region adjacent to the package region of interest areconnected to each other by an inclined reinforcement piece positioned inthe dicing region.

In the lead frame according to the present invention, the lead sectionin one package region is connected to the lead section in anotherpackage region adjacent to the package region of interest, by a leadconnecting portion.

In the lead frame according to the present invention, the die pad in onepackage region is connected to the die pad in another package regionadjacent to the package region of interest, by a die pad connectingportion.

In the lead frame according to the present invention, the die pad in onepackage region and the lead section in a first package region adjacentto the package region of interest are connected to each other by a firstinclined reinforcement piece positioned in the dicing region, and thedie pad in one package region and the lead section in a second packageregion adjacent to the package region of interest, the second packageregion being positioned at a side opposite to the first package regionwith regard to the package region of interest, are connected to eachother by a second inclined reinforcement piece positioned in the dicingregion.

In the lead frame according to the present invention, the die pad in onepackage region and the lead section in another package region adjacentto the package region of interest are connected to each other by a firstinclined reinforcement piece positioned in the dicing region. The leadsection in one package region and the die pad in another package regionadjacent to the package region of interest are connected to each otherby a second inclined reinforcement piece positioned in the dicingregion.

In the lead frame according to the present invention, the die pad in onepackage region is connected to the lead sections in diagonally upwardand diagonally downward package regions adjacent to the die pad in thepackage region of interest, by one pair of additional inclinedreinforcement pieces positioned in the dicing region.

In the lead frame according to the present invention, the lead sectionin one package region is connected to the lead sections in diagonallyupward and diagonally downward package regions adjacent to the leadsection in the package region of interest, by one pair of additionalinclined reinforcement pieces positioned in the dicing region.

A lead frame for mounting LED elements, according to the presentinvention, includes: a frame body region; and a large number of packageregions arranged in multiple rows and columns in the frame body region,the package regions each including a die pad on which an LED element isto be mounted and a lead section adjacent to the die pad, the packageregions being further constructed to be interconnected via a dicingregion. The lead section in at least one package region is connected tothe lead section in another package region adjacent to the packageregion of interest, by a lead connecting portion. The lead section inone package region and the die pad in another package region adjacent tothe package region of interest are connected to each other by aninclined reinforcement piece positioned in the dicing region.

In the lead frame according to the present invention, the inclinedreinforcement piece includes a main body and a plated layer formed onthe main body.

A resin-containing lead frame according to the present inventionincludes a lead frame and a reflecting resin disposed on edges ofpackage regions in the lead frame.

A method for manufacturing a semiconductor device according to thepresent invention includes the steps of: providing a resin-containinglead frame; mounting an independent LED element on each of die pads,inside a reflecting resin of the resin-containing lead frame;interconnecting the LED element and a lead section via an electricconducting portion; filling the reflecting resin of the resin-containinglead frame with a sealing resin; and separating the reflecting resin andthe lead frame, for each LED element, by cutting the reflecting resinand the lead frame.

A lead frame for mounting semiconductor elements, according to thepresent invention, includes: a frame body region; and a large number ofpackage regions arranged in multiple rows and columns in the frame bodyregion, the package regions each including a die pad on which asemiconductor element is to be mounted and a lead section adjacent tothe die pad, the package regions being constructed to be interconnectedvia a dicing region. The die pad in one package region and the leadsection in another package region adjacent to the package region ofinterest are connected to each other by an inclined reinforcement piecepositioned in the dicing region.

In the lead frame according to the present invention, the lead sectionin one package region is connected to the lead section in anotherpackage region adjacent to the package region of interest, by a leadconnecting portion.

In the lead frame according to the present invention, the die pad in onepackage region is connected to the die pad in another package regionadjacent to the package region of interest, by a die pad connectingportion.

In the lead frame according to the present invention, the die pad in onepackage region and the lead section in a first package region adjacentto the package region of interest are connected to each other by a firstinclined reinforcement piece positioned in the dicing region. The diepad in one package region and the lead section in a second packageregion adjacent to the package region of interest, the second packageregion being positioned at a side opposite to the first package regionwith regard to the package region of interest, are connected to eachother by a second inclined reinforcement piece positioned in the dicingregion.

In the lead frame according to the present invention, the die pad in onepackage region and the lead section in another package region adjacentto the package region of interest are connected to each other by a firstinclined reinforcement piece positioned in the dicing region, and thelead section in one package region and the die pad in another packageregion adjacent to the package region of interest are connected to eachother by a second inclined reinforcement piece positioned in the dicingregion.

In the lead frame according to the present invention, the die pad in onepackage region is connected to the lead sections in diagonally upwardand diagonally downward package regions adjacent to the die pad in thepackage region of interest, by one pair of additional inclinedreinforcement pieces positioned in the dicing region.

In the lead frame according to the present invention, the lead sectionin one package region is connected to the lead sections in diagonallyupward and diagonally downward package regions adjacent to the leadsection in the package region of interest, by one pair of additionalinclined reinforcement pieces positioned in the dicing region.

A lead frame for mounting semiconductor elements, according to thepresent invention, includes: a frame body region; and a large number ofpackage regions arranged in multiple rows and columns in the frame bodyregion, the package regions each including a die pad on which asemiconductor element is to be mounted and a lead section adjacent tothe die pad, the package regions being further constructed to beinterconnected via a dicing region. The lead section in at least onepackage region is connected to the lead section in another packageregion adjacent to the package region of interest, by a lead connectingportion. The lead section in one package region and the die pad inanother package region adjacent to the package region of interest areconnected to each other by an inclined reinforcement piece positioned inthe dicing region.

In accordance with the present invention, since the die pad in onepackage region and the lead section in another package region adjacentto the package region of interest are connected to each other by aninclined reinforcement piece positioned in the dicing region, thisstructural characteristic prevents spatial gaps between the die pads andthe lead sections from becoming connected, thus a plurality of elongatedspaces parallel to one side of the lead frame from being formed, andhence, deformation of the lead frame during handling is prevented.

A lead frame for mounting LED elements, according to the presentinvention, includes: a frame body region; and a large number of packageregions arranged in multiple rows and columns in the frame body region,the package regions each including a die pad on which an LED element isto be mounted and a lead section adjacent to the die pad, the packageregions being further constructed to be interconnected via a dicingregion. The die pad and lead section in one package region are connectedto the die pad and lead section in another package region adjacent tothe package region of interest, by a die pad connecting portion and alead connecting portion, respectively. The die pad connecting portionand the lead connecting portion are connected to each other by areinforcement piece positioned in the dicing region.

In the lead frame according to the present invention, the reinforcementpiece extends over entire inside length of the frame body region andconnects a plurality of die pad connecting portions and lead connectingportions.

In the lead frame according to the present invention, the die padconnecting portion and lead connecting portion connecting the die padsand lead sections, respectively, in both of one package region and afirst package region adjacent thereto, are connected to each other by areinforcement piece positioned in the dicing region. The die padconnecting portion and lead connecting portion connecting the die padsand lead sections, respectively, in both of the package region ofinterest and a second package region adjacent thereto, the secondpackage region being positioned at a side opposite to the first packageregion with regard to the package region of interest and being adjacentto the package region of interest, are not connected to each other by areinforcement piece.

In the lead frame according to the present invention, the reinforcementpiece extends only between the die pad connecting portion and leadconnecting portion connected to the die pad and lead section,respectively, in one package region, and connects the die pad connectingportion and the lead connecting portion.

In the lead frame according to the present invention, each packageregion includes one die pad and first and second lead sections, thefirst and second lead sections being positioned across the die pad. Thedie pad, first lead section, and second lead section existing in onepackage region are connected to the die pad, first lead section, andsecond lead section existing in another package region adjacent to thepackage region of interest, by a die pad connecting portion, afirst-lead connecting portion, and a second-lead connecting portion,respectively. Between the package region of interest and a first packageregion adjacent thereto, the reinforcement piece extends only betweenthe die pad connecting portion and the first-lead connecting portion,and connects the die pad connecting portion and the first-leadconnecting portion. Between the package region of interest and a secondpackage region adjacent thereto, the second package region beingpositioned at a side opposite to the first package region with regard tothe package region of interest and being adjacent to the package regionof interest, the reinforcement piece extends only between the die padconnecting portion and the second-lead connecting portion, and connectsthe die pad connecting portion and the second-lead connecting portion.

A lead frame for mounting LED elements, according to the presentinvention, includes: a frame body region; and a large number of packageregions arranged in multiple rows and columns in the frame body region,the package regions each including a die pad on which an LED element isto be mounted and a lead section adjacent to the die pad, the packageregions being further constructed to be interconnected via a dicingregion. The die pad and lead section in one package region are connectedto the die pad and lead section in another package region longitudinallyadjacent to the package region of interest, by a die pad connectingportion and a lead connecting portion, respectively. The die padconnecting portions and lead connecting portions positioned in part of aplurality of dicing regions extending in a lateral direction areconnected to each other by reinforcement pieces positioned in the partof the dicing regions.

In the lead frame according to the present invention, of all the dicingregions extending in the lateral direction, only those each providedwith a reinforcement piece are cyclically formed at a predeterminednumber of alternate positions.

In the lead frame according to the present invention, of all the dicingregions extending in the lateral direction, only those each providedwith a reinforcement piece are formed irregularly.

In the lead frame according to the present invention, the reinforcementpiece includes a main body and a plated layer formed on the main body.

A resin-containing lead frame according to the present inventionincludes a lead frame and a reflecting resin disposed on edges ofpackage regions in the lead frame.

A method for manufacturing a semiconductor device according to thepresent invention includes the steps of: providing a resin-containinglead frame; mounting an independent LED element on each of die pads,inside a reflecting resin of the resin-containing lead frame;interconnecting the LED element and a lead section via an electricconducting portion; filling the reflecting resin of the resin-containinglead frame with a sealing resin; and separating the reflecting resin andthe lead frame, for each LED element, by cutting the reflecting resinand the lead frame.

A lead frame for mounting semiconductor elements, according to thepresent invention, includes: a frame body region; and a large number ofpackage regions arranged in multiple rows and columns in the frame bodyregion, the package regions each including a die pad on which asemiconductor element is to be mounted and a lead section adjacent tothe die pad, the package regions being further constructed to beinterconnected via a dicing region. The die pad and lead section in onepackage region are connected to the die pad and lead section in anotherpackage region adjacent to the package region of interest, by a die padconnecting portion and a lead connecting portion, respectively, and thedie pad connecting portion and the lead connecting portion are connectedto each other by a reinforcement piece positioned in the dicing region.

In the lead frame according to the present invention, the reinforcementpiece extends over entire inside length of the frame body region andconnects a plurality of die pad connecting portions and lead connectingportions.

In the lead frame according to the present invention, the die padconnecting portion and lead connecting portion connecting the die padsand lead sections, respectively, in both of one package region and afirst package region adjacent thereto, are connected to each other by areinforcement piece positioned in the dicing region. The die padconnecting portion and lead connecting portion connecting the die padsand lead sections, respectively, in both of the package region ofinterest and a second package region adjacent thereto, the secondpackage region being positioned at a side opposite to the first packageregion with regard to the package region of interest and being adjacentto the package region of interest, are not connected to each other by areinforcement piece.

In the lead frame according to the present invention, the reinforcementpiece extends only between the die pad connecting portion and leadconnecting portion connected to the die pad and lead section,respectively, in one package region, and connects the die pad connectingportion and the lead connecting portion.

In the lead frame according to the present invention, each packageregion includes one die pad and first and second lead sections, thefirst and second lead sections being positioned across the die pad. Thedie pad, first lead section, and second lead section existing in onepackage region are connected to the die pad, first lead section, andsecond lead section existing in another package region adjacent to thepackage region of interest, by a die pad connecting portion, afirst-lead connecting portion, and a second-lead connecting portion,respectively. Between the package region of interest and a first packageregion adjacent thereto, the reinforcement piece extends only betweenthe die pad connecting portion and the first-lead connecting portion,and connects the die pad connecting portion and the first-leadconnecting portion. Between the package region of interest and a secondpackage region adjacent thereto, the second package region beingpositioned at a side opposite to the first package region with regard tothe package region of interest and being adjacent to the package regionof interest, the reinforcement piece extends only between the die padconnecting portion and the second-lead connecting portion, and connectsthe die pad connecting portion and the second-lead connecting portion.

A lead frame for mounting semiconductor elements, according to thepresent invention, includes: a frame body region; and a large number ofpackage regions arranged in multiple rows and columns in the frame bodyregion, the package regions each including a die pad on which asemiconductor element is to be mounted and a lead section adjacent tothe die pad, the package regions being further constructed to beinterconnected via a dicing region. The die pad and lead section in onepackage region are connected to the die pad and lead section in anotherpackage region longitudinally adjacent to the package region ofinterest, by a die pad connecting portion and a lead connecting portion,respectively. The die pad connecting portions and lead connectingportions positioned in part of a plurality of dicing regions extendingin a lateral direction are connected to each other by reinforcementpieces positioned in the part of the dicing regions.

In the lead frame according to the present invention, of all the dicingregions extending in the lateral direction, only those each providedwith a reinforcement piece are cyclically formed at a predeterminednumber of alternate positions.

In the lead frame according to the present invention, of all the dicingregions extending in the lateral direction, only those each providedwith a reinforcement piece are formed irregularly.

In accordance with the present invention, since the die pad connectingportion and the lead connecting portion are connected to each other byan reinforcement piece positioned in the dicing region, this structuralfeature prevents spatial gaps between die pads and lead sections frombecoming connected, thus a plurality of elongated spaces parallel to oneside of the lead frame from being formed, and hence, deformation of thelead frame during handling.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an overall plan view of a lead frame according to a firstembodiment of the present invention.

FIG. 2 is a partly enlarged plan view of the lead frame according to thefirst embodiment of the present invention, the plan view showing sectionA of FIG. 1.

FIG. 3 is a sectional view of the lead frame according to the firstembodiment of the present invention, the sectional view being takenalong line B-B in FIG. 2.

FIG. 4 is a sectional view showing a semiconductor device fabricatedusing the lead frame according to the first embodiment of the presentinvention, the sectional view being taken along line C-C in FIG. 5.

FIG. 5 is a plan view showing the semiconductor device fabricated usingthe lead frame according to the first embodiment of the presentinvention.

FIG. 6 is a diagram showing a method of manufacturing the lead frameaccording to the first embodiment of the present invention.

FIG. 7 is a diagram that shows steps for manufacturing the semiconductordevice using the lead frame according to the first embodiment of thepresent invention.

FIG. 8 is a diagram that showing further steps for manufacturing thesemiconductor device using the lead frame according to the firstembodiment of the present invention.

FIG. 9 is a diagram that shows dicing, one of the steps formanufacturing the semiconductor device.

FIG. 10 is a partly enlarged plan view that shows modification 1-1, anexample of modification, of the lead frame according to the firstembodiment of the present invention.

FIG. 11 is a partly enlarged plan view that shows modification 1-2,another example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 12 is a partly enlarged plan view that shows modification 1-3, yetanother example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 13 is a partly enlarged plan view that shows modification 1-4, afurther example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 14 is a partly enlarged plan view that shows modification 1-5, afurther example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 15 is a partly enlarged plan view that shows modification 1-6, afurther example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 16 is a partly enlarged plan view that shows modification 1-7, afurther example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 17 is a partly enlarged plan view that shows modification 1-8, afurther example of modification, of the lead frame according to thefirst embodiment of the present invention.

FIG. 18 is a sectional view that shows modification A, an example ofmodification, of the semiconductor device.

FIG. 19 is a sectional view that shows modification B, another exampleof modification, of the semiconductor device.

FIG. 20 is a sectional view that shows modification C, yet anotherexample of modification, of the semiconductor device.

FIG. 21 is an overall plan view of a lead frame according to a secondembodiment of the present invention.

FIG. 22 is a partly enlarged plan view of the lead frame according tothe second embodiment of the present invention, the plan view showingsection D of FIG. 21.

FIG. 23 is a sectional view of the lead frame according to the secondembodiment of the present invention, the sectional view being takenalong line E-E in FIG. 22.

FIG. 24 is a sectional view showing a semiconductor device fabricatedusing the lead frame according to the second embodiment of the presentinvention, the sectional view being taken along line F-F in FIG. 25.

FIG. 25 is a plan view showing the semiconductor device fabricated usingthe lead frame according to the second embodiment of the presentinvention.

FIG. 26 is a diagram showing a method of manufacturing the lead frameaccording to the second embodiment of the present invention.

FIG. 27 is a diagram that shows steps for manufacturing thesemiconductor device using the lead frame according to the secondembodiment of the present invention.

FIG. 28 is a diagram that showing further steps for manufacturing thesemiconductor device using the lead frame according to the secondembodiment of the present invention.

FIG. 29 is a diagram that shows dicing, one of the steps formanufacturing the semiconductor device.

FIG. 30 is a partly enlarged plan view that shows modification 2-1, anexample of modification, of the lead frame according to the secondembodiment of the present invention.

FIG. 31 is a partly enlarged plan view that shows modification 2-2,another example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 32 is a partly enlarged plan view that shows modification 2-3, yetanother example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 33 is a partly enlarged plan view that shows modification 2-4, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 34 is a partly enlarged plan view that shows modification 2-5, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 35 is a partly enlarged plan view that shows modification 2-6, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 36 is a partly enlarged plan view that shows modification 2-7, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 37 is a schematic plan view showing the semiconductor devicefabricated using the lead frame according to modification 2-7 (FIG. 36).

FIG. 38 is a partly enlarged plan view that shows modification 2-8, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 39 is a schematic plan view showing the semiconductor devicefabricated using the lead frame according to modification 2-8 (FIG. 38).

FIG. 40 is a partly enlarged plan view that shows modification 2-9, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 41 is a partly enlarged plan view that shows modification 2-10, afurther example of modification, of the lead frame according to thesecond embodiment of the present invention.

FIG. 42 is a sectional view of a lead frame according to a thirdembodiment of the present invention.

FIG. 43 is a sectional view showing a semiconductor device fabricatedusing the lead frame according to the third embodiment of the presentinvention.

FIG. 44 is a sectional view that shows steps for manufacturing thesemiconductor device using the lead frame according to the thirdembodiment of the present invention.

MODES FOR CARRYING OUT THE INVENTION First Embodiment

Hereunder, a first embodiment of the present invention will be describedreferring to the accompanying drawings. FIGS. 1 to 6 show the firstembodiment of the present invention.

The first embodiment of the present invention is described belowreferring to FIGS. 1 to 20.

Leaf Frame Configuration

First, a lead frame for mounting LED elements, according to the presentembodiment, is outlined below per FIGS. 1 to 3. FIG. 1 is an overallplan view of the lead frame according to the present embodiment, FIG. 2is an enlarged view of section A shown in FIG. 1, and FIG. 3 is asectional view taken along line B-B in FIG. 2.

The lead frame 10 shown in FIG. 1 is used to fabricate semiconductordevices 20 each having an LED element 21 mounted thereupon, one of thesemiconductor devices 20 being shown in FIGS. 4 and 5. The lead frame 10includes a frame body region 13 having an outline of a rectangularshape, and a large number of package regions 14 arranged in multiplerows and columns (i.e., in matrix form) inside the frame body region 13.

As shown in FIG. 2, the package regions 14 each include a die pad 25 onwhich an LED element 21 is to be mounted, and a lead section 26 adjacentto the die pad 25. The package regions 14 are also connected to oneanother via dicing regions 15.

A spatial gap is formed between the die pad 25 and lead section 26 inone package region 14, and the lead frame 10 is constructed so that thedie pad 25 and the lead section 26 are electrically insulated from oneanother after dicing of the lead frame. Each package region 14 isprovided for an independent semiconductor device 20. Each package region14 is shown with a double-dotted line in FIG. 2.

On the other hand, the dicing regions 15 each extend in bothlongitudinal and lateral directions between the package regions 14. Aswill be detailed later herein, each dicing region 15 serves as a regionthrough which blades 38 pass during the manufacture of semiconductordevices 20 when the lead frame 10 is separated for each package region14. Each dicing region 15 is shown in hatched or shaded form in FIG. 2.

In this specification, as shown in FIG. 2, the lateral direction inwhich the lead sections 26 and die pads 25 in each package region 14 arearranged side by side corresponds to a direction of X, and thelongitudinal direction in which the lead sections 26 and die pads 25 arearranged in tandem corresponds to a direction of Y. In addition, a plusside of the Y-direction and a minus side of the Y-direction arehereinafter referred to as upward and downward, and a plus side of theX-direction and a minus side of the X-direction, as rightward andleftward.

As shown in FIG. 2, the die pad 25 in one package region 14 and the leadsection 26 in another package region 14 upward adjacent to that packageregion 14 are connected to each other by an inclined reinforcement piece51. The lead section 26 in one package region 14 and the die pad 25 inanother package region 14 downward adjacent to that package region 14are connected to each other by another inclined reinforcement piece 51.Each inclined reinforcement piece 51 is positioned in one dicing region15, the reinforcement piece 51 being disposed so as to be oblique withrespect to both of the X- and Y-directions in FIG. 2.

The lead sections 26 in each package region 14 are connected to the leadsections 26 in other package regions 14 upward and downward adjacent tothe particular package region 14, by respective lead connecting portions52. In addition, the die pads 25 in each package region 14 are connectedto the die pads 25 in other package regions 14 upward and downwardadjacent to the particular package region 14, by respective die padconnecting portions 53. The lead connecting portions 52 and the die padconnecting portions 53 are all positioned in dicing regions 15, theconnecting portions 52, 53 each being disposed in parallel to theY-direction.

The die pad 25 in the package region 14 is further connected to the leadsection 26 in another package region 14 rightward adjacent to theparticular package region 14, by a package region connecting portion 54.Additionally, the lead section 26 in the package region 14 is furtherconnected to the die pad 25 in another package region 14 leftwardadjacent to the particular package region 14, by another package regionconnecting portion 54. Each package region connecting portion 54 ispositioned in one dicing region 15, the connecting portion 54 beingdisposed in parallel to the X-direction.

The lead sections 26 and die pads 25 in outermost package regions 14 areeach connected to the frame body region 13 by one of an inclinedreinforcement piece 51, a lead connecting portion 52, a die padconnecting portion 53, and a package region connecting portion 54, or aplurality of these elements.

As shown in the sectional view of FIG. 3, the lead frame 10 includes alead frame main body 11 and a plated layer 12 formed on the lead framemain body 11.

The lead frame main body (hereinafter referred to simply as the leadframe body) 11 is formed from a sheet of metal. The metal sheetconstituting the lead frame body 11 can be of a material such as copper,copper alloy, or 42-alloy (a Fe alloy with a 42% Ni content). Thicknessof the lead frame body 11 depends on the configuration of thesemiconductor device. Preferable thickness, however, ranges between 0.05mm and 0.5 mm, inclusive.

The plated layer 12 is provided on entire upper and lower surfaces ofthe lead frame body 11. The plated layer 12 on the upper-surface sidefunctions as a reflective layer for reflecting light from an LED element21. The plated layer 12 on the lower-surface side, on the other hand,plays a role in enhancing adhesion to solder. This plated layer 12 isformed from an electroplated layer of silver (Ag), for example. Theplated layer 12 is formed to have extremely small thickness. Morespecifically, this value preferably ranges between 0.005 μm and 0.2 μm,inclusive. The plated layer 12 does not always need to be provided onthe upper and lower surfaces of the lead frame body 11, and may only beprovided on part of the upper and lower surfaces of the lead frame body11.

In addition, a first outer lead section 27 is formed on a lower surfaceof the die pad 25, and a second outer lead section 28 on a lower surfaceof the lead section 26. The first outer lead section 27 and the secondouter lead section 28 are used to interconnect the semiconductor device20 and an external wiring substrate, respectively.

Grooves 18 for enhancing adhesion between the lead frame 10 and areflecting resin 23 (described later herein) are also formed on theupper surface of the lead frame 10. Representation of the grooves 18 isomitted in FIG. 2.

Semiconductor Device Configuration

Next, an embodiment of a semiconductor device fabricated using the leadframe shown in FIGS. 1 to 3 is described below per FIGS. 4 and 5. FIG. 4is a sectional view of the semiconductor device (SON type), and FIG. 5is a plan view thereof.

As shown in FIGS. 4 and 5, the semiconductor device 20 includes a(singulated) lead frame 10, an LED element 21 rested on a die pad 25 ofthe lead frame 10, and a bonding wire (electric conductor) 22 thatelectrically interconnects the LED element 21 and a lead section 26 ofthe lead frame 10.

In addition, a reflecting resin 23 with a recess 23 a is provided aroundthe LED element 21. The reflecting resin 23 is integrated with the leadframe 10. Furthermore, the LED element and the bonding wire 22 are bothsealed with a light-transmissive sealing resin 24. The recess 23 a inthe reflecting resin 23 is filled with the sealing resin 24.

Members that constitute the thus-configured semiconductor device 20 aredescribed in order below.

If a material formed from compound semiconductor single crystals such asGaP, GaAs, GaAlAs, GaAsP, AlInGaP, and/or InGaN, is appropriatelyselected for a light-emitting layer, a light-emission wavelength rangingbetween those of ultraviolet light and those of infrared light,inclusive, can be selected for the LED element 21. A commonly usedconventional element can be used as such an LED element 21.

The LED element 21 is fixedly mounted on the die pad 25, inside therecess 23 a of the reflecting resin 23, via solder or a die-bondingpaste. If a die-bonding paste is to be used, the die-bonding paste canbe that formed from a light-resistant epoxy resin or silicone resin.

The bonding wire 22 is formed from a highly electroconductive materialsuch as gold, with one end thereof being connected to a terminal section21 a of the LED element 21, and with the other end thereof beingconnected to an upper portion of the lead section 26.

The reflecting resin 23 is formed by, for example, thermoplastic resininjection molding or transfer molding over the lead frame 10, forexample. The reflecting resin 23 can vary in shape according to a designof a mold used during the injection molding or transfer molding of theresin. For example, the entire reflecting resin 23 can be formed into aregularly parallelepipedic shape as shown in FIGS. 4 and 5, or formedinto a shape of a cylinder, pyramid/cone, or the like. The recess 23 acan have either a rectangular, circular, elliptical, or polygonalbottom. Sidewalls of the recess 23 a may have either a rectilinearcross-sectional shape as shown in FIG. 4, or have a curvilinear one.

A material excelling particularly in heat resistance, weatherability,and mechanical strength is desirably selected for the thermoplasticresin used as the reflecting resin 23. The useable kinds ofthermoplastic resin materials are polyimide, polyphthalalamide,polyphenylene sulfide, liquid-crystal polymers, polyether sulphone,silicone, epoxies, polyetherimide, polyurethane, polybutyleneterephthalate, and the like. If titanium dioxide, zirconium dioxide,potassium titanate, aluminum nitride, or boron nitride is added as alight-reflecting agent to the resin, this increases a reflectance oflight from the light-emitting element, at the bottom and sidewalls ofthe recess 23 a, thus increasing optical extraction efficiency of theentire semiconductor device 20.

A material high in an index of refraction as well as in opticaltransmittance at the light-emission wavelength of the semiconductordevice 20 is desirably selected as the sealing resin 24. An epoxy resinor a silicone resin can therefore be selected as a resin that satisfieshigh heat resistance, weatherability, and mechanical strengthrequirements. To use a high-luminance LED, in particular, as the LEDelement 21, the sealing resin 24 is preferably formed from a highlyweatherable silicone resin material since the sealing resin 24 isexposed to strong light.

The configuration of the lead frame 10 has already been described usingFIGS. 1 to 3, so further detailed description of the lead frame 10 isomitted herein.

Method of Manufacturing the Lead Frame for Mounting LED Elements

Next, a method of manufacturing the lead frame 10 shown in FIGS. 1 to 3is described below using FIGS. 6(a) to 6(f).

First, a metallic substrate 31 of a flat-plate shape is provided asshown in FIG. 6(a). The metallic substrate 31 can, as outlined above, bethat formed from copper, a copper alloy, a 42-alloy (a Fe alloy with a42% Ni content), and/or the like. Both sides of the metallic substrate31 are preferably degreased and cleaned beforehand.

Next as shown in FIG. 6(b), entire upper and lower surfaces of themetallic substrate 31 are coated with photosensitive resists 32 a and 33a, respectively, and then the resists are dried. The photosensitiveresists 32 a, 33 a can be conventionally known ones.

Following the above, light exposure of the metallic substrate 31 via aphotomask takes place, and developing further follows. Etching resistlayers 32 and 33 with desired openings 32 b and 33 b, respectively, arethen formed as shown in FIG. 6(c).

Next as shown in FIG. 6(d), etching of the metallic substrate 31 with anetchant occurs using the etching resist layers 32, 33 as anti-etchingfilms. An appropriate chemical as the etchant can be selected accordingto a material of the metallic substrate 31 to be used. For example, touse copper as the metallic substrate 31, the substrate can usually bespray-etched from both sides using an aqueous ferric chloride solution.

After that, the etching resist layers 32, 33 are peeled off, whereby thelead frame body 11 is then obtained as shown in FIG. 6(e). At this time,the inclined reinforcement pieces 51, lead connecting portions 52, diepad connecting portions 53, and package region connecting portions 54shown in FIG. 2 are also formed as a result of etching.

Next, the upper and lower surfaces of the lead frame body 11 areprovided with electrolytic plating to deposit a metal (silver) onto thelead frame body 11 and form a plated layer 12 on the upper and lowersurfaces of the lead frame body 11. This state is shown in FIG. 6(f). Inthis case, since the inclined reinforcement pieces 51, the leadconnecting portions 52, the die pad connecting portions 53, and thepackage region connecting portions 54 all include the main body (thelead frame body 11) and the plated layer 12 formed on the body, theinclined reinforcement pieces 51, the lead connecting portions 52, thedie pad connecting portions 53, and the package region connectingportions 54 are enhanced in strength.

More specifically, during the formation of the above, the lead framebody 11 goes through steps such as electrolytic degreasing, pickling,chemical polishing, copper striking, water washing, neutral degreasing,cyanide cleaning, and silver plating, in that order, to be formed withthe plated layer 12 on the lead frame body 11. An electroplatingsolution used in the silver-plating step can be, for example, asilver-plating solution composed mainly of silver cyanide. In an actualprocess, water washing is added between steps, as required.Alternatively, the plated layer 12 may be formed on part of the leadframe body 11 by adding a patterning step midway in the process.

In this manner, the lead frame 10 that was shown in FIGS. 1 to 3 isobtained. FIG. 6(f) shows the as-fabricated state of the lead frame 10.

While the method of manufacturing the lead frame 10 by etching in FIGS.6(a) to 6(f) has been shown and described, this manufacturing method maybe replaced by fabrication with a press.

Method of Manufacturing the Semiconductor Device

Next, a method of manufacturing the semiconductor device 20 shown inFIGS. 4 and 5 is described below using FIGS. 7(a) to 7(d), 8(a) to 8(e),and 9(a) and 9(b).

First, the lead frame 10 is fabricated in the steps of FIGS. 6(a) to6(f). FIG. 7(a) shows the thus-fabricated lead frame 10.

After the fabrication, the lead frame 10 is mounted in a mold 35 of aninjection molding machine or transfer molding machine (not shown), as inFIG. 7(b). Spaces 35 a appropriate for the shape of the reflecting resin23 are formed in the mold 35.

Next, a thermoplastic resin is poured into the mold 35 from a resinsupply section (not shown) of the injection molding machine or transfermolding machine, and then cured. This forms the reflecting resin 23 onthe plated layer 12 of the lead frame 10, as shown in FIG. 7(c).

The lead frame 10 with the reflecting resin 23 formed therein is removedfrom the mold 35. As shown in FIG. 7(d), a resin-containing lead frame30 is thus obtained as a structure formed by integrating the reflectingresin 23 and the lead frame 10. In this way, the present embodiment alsoprovides a resin-containing lead frame 30 that includes the lead frame10 and the reflecting resin 23 disposed on edges of each package region14 in the lead frame 10.

Next, an LED element 21 is mounted on the die pad 25 of the lead frame10, in each reflecting resin 23 of the resin-containing lead frame 30.In this case, as shown in FIG. 8(a), the LED element 21 is rested on andfixed to the die pad 25 by use of solder or a die-bonding paste (thisstep is called die-attaching).

Next as shown in FIG. 8(b), the terminal section 21 a of the LED element21 and an upper surface of the lead section 26 are electricallyconnected to each other via a bonding wire 22 (this step is called wirebonding).

After this, the recess 23 a in the reflecting resin 23 is filled with asealing resin 24, whereby the LED element 21 and the bonding wire 22 arethen sealed with the sealing resin 24. This state is shown in FIG. 8(c).

Next as shown in FIG. 8(d), the reflecting resin 23 and the lead frame10 are separated for each LED element 21 by cutting those sections ofthe dicing region 15 that correspond to the reflecting resin 23 and thelead frame 10 (this cutting step is called dicing). At this time, thelead frame 10 is first rested on and fixed to a dicing tape 37, and thenthe inclined reinforcement pieces 51, lead connecting portions 52, diepad connecting portions 53, and package region connecting portions 54 ofthe lead frame 10, in addition to the reflecting resin 23 between theLED elements 21, are cut using, for example, a blade 38 made of adiamond grinding wheel or the like.

During the cutting step, as shown in FIG. 9(a), the lead frame 10 may becut using a relatively thick blade 38 appropriate for particular widthof the dicing region 15. In this case, adjacent package regions 14 canbe efficiently separated from each other in one cutting operation. As analternative, the lead frame 10 may be cut in two cutting operationsusing a relatively thin blade 38 narrower than the width of the dicingregion 15, as shown in FIG. 9(b). In this case, the blade 38 can beincreased in feed rate per cutting operation and extended in life.

The semiconductor device 20 shown in FIGS. 4 and 5 is thus obtained.FIG. 8(e) shows the lead frame being cut.

As described above, in accordance with the present embodiment, the diepad 25 in one package region 14 and the lead section 26 in anotherpackage region 14 adjacent to that package region 14 are connected toeach other by an inclined reinforcement piece 51 positioned in thedicing region. In addition, the die pad 25 in one package region 14 isconnected to the lead section 26 in another package region 14 adjacentto that package region 14, by a package region connecting portion 54.These structural features and characteristics prevent an elongated spacefrom occurring in a vertical direction of the lead frame 10, and henceprevent the lead frame 10 from being formed into a vertically slitblind/screen or interdigitated shape, and from becoming deformed duringhandling.

Furthermore, the lead section 26 in one package region 14 is connectedto the lead section 26 in another package region 14 adjacent to thatpackage region 14, by a lead connecting portion 52, and the die pad 25in one package region 14 is connected to the die pad 25 in anotherpackage region 14 adjacent to that package region 14, by a die padconnecting portion 53. These structural features and characteristicsprevent an elongated space from occurring in a horizontal direction ofthe lead frame 10, and hence prevent the lead frame 10 from being formedinto a horizontally slit blind/screen or interdigitated shape, and frombecoming deformed during handling.

The deformation of the lead frame 10 is thus prevented, so when thereflecting resin 23 is formed in the lead frame 10 as shown in FIGS.7(b) and 7(c), a forming position of the reflecting resin 23 withrespect to the lead frame 10 does not shift. It is therefore easy tomount a large-area LED element 21 in a small package region 14, to mounta plurality of LED elements 21, or to mount an antistatic protectionelement in addition to an LED element 21.

Additionally, the present embodiment makes it unnecessary to provide tiebars of a matrix format around any package regions 14, thus allowspackage regions 14 to be arranged in proximity to one another, and hencethe number of package regions 14 in one lead frame 10 to be increased byhigher-density mounting.

Furthermore, in the present embodiment, since a connecting bar such as ahanging lead is absent at any corners of a package region 14, thereflecting resin 23 is not likely to peel from the lead frame 10, atcorners of the semiconductor device 20, and thus, reliability of thesemiconductor device 20 improves.

Modifications of the Lead Frame

Hereunder, various examples of modification, as modifications 1-1 to1-8, of the lead frame according to the present embodiment are describedreferring to FIGS. 10 to 17. FIGS. 10 to 17 are partly enlarged planviews showing the modifications of the lead frame, the plan views eachcorresponding to FIG. 2. In FIGS. 10 to 17, the same elements as thoseshown in FIGS. 1 to 9 are each assigned the same reference number orsymbol, and detailed description of these elements is omitted herein.

Modification 1-1

FIG. 10 shows a lead frame 10A according to one modification(modification 1-1) of the present embodiment. Unlike that of theembodiment shown in FIGS. 1 to 9, the lead frame 10A shown in FIG. 10does not include a die pad connecting portion 53 that connects any diepads 25.

In other words, the die pad 25 in one package region 14 is connected tothe lead section 26 in another package region 14 upward adjacent to thatpackage region 14, by an inclined reinforcement piece 51, and isconnected to the lead section 26 in yet another package region 14rightward adjacent to that package region 14, by a package regionconnecting portion 54. The die pad 25 in one package region 14, however,is not directly connected to the die pad 25 in other package regions 14upward or downward adjacent to that package region 14.

Not providing a die pad connecting portion 53 in this way allows adicing load upon the blade 38 to be alleviated. Other structuralfeatures and characteristics are substantially the same as those of theembodiment shown in FIGS. 1 to 9.

Modification 1-2

FIG. 11 shows a lead frame 10B according to another modification(modification 1-2) of the present embodiment. Unlike that of theembodiment shown in FIGS. 1 to 9, the lead frame 10B shown in FIG. 11does not include a lead connecting portion 52 that connects any leadsections 26.

In other words, the lead section 26 in one package region 14 isconnected to the die pad 25 in another package region 14 downwardadjacent to that package region 14, by an inclined reinforcement piece51, and is connected to the die pad 25 in yet another package region 14leftward adjacent to that package region 14, by a package regionconnecting portion 54. The lead section 26 in one package region 14,however, is not directly connected to the lead sections 26 in otherpackage regions 14 upward or downward adjacent to that package region14.

Not providing a lead connecting portion 52 in this way allows the dicingload upon the blade 38 to be alleviated. Other structural features andcharacteristics are substantially the same as those of the embodimentshown in FIGS. 1 to 9.

Modification 1-3

FIG. 12 shows a lead frame 10C according to yet another modification(modification 1-3) of the present embodiment. Unlike those of theembodiment shown in FIGS. 1 to 9, package regions 14 in the lead frame10C shown in FIG. 12, each include one die pad 25 and one pair of leadsections positioned across the die pad 25, namely 26 a and 26 b(hereinafter, these lead sections are also referred to as first leadsection 26 a and second lead section 26 b; and this kind of lead frameis called a three-pin type).

In this case, the die pad 25 in one package region 14 and the first leadsection 26 a in a package region 14 (a first package region) upwardadjacent to that package region 14 are connected to each other by afirst inclined reinforcement piece 51 a. In addition, the die pad 25 inone package region 14 and the second lead section 26 b in a packageregion 14 (a second package region positioned at a side opposite to thefirst package region with regard to that package region 14) that isdownward adjacent to the particular package region 14 are connected toeach other by a second inclined reinforcement piece 51 b. The firstinclined reinforcement piece 51 a and the second inclined reinforcementpiece 51 b are both positioned in a dicing region 15.

Furthermore, the die pad 25 in one package region 14 is connected to thedie pads 25 in the package regions 14 (the first package region andsecond package region) that are upward and downward adjacent to thatpackage region 14, by respective die pad connecting portions 53.Similarly, the first lead section 26 a in one package region 14 isconnected to the first lead sections 26 a in the package regions 14 (thefirst package region and second package region) that are upward anddownward adjacent to that package region 14, by respective first leadconnecting portions 52 a. Similarly, the second lead section 26 b in onepackage region 14 is connected to the second lead sections 26 b in thepackage regions 14 (the first package region and second package region)that are upward and downward adjacent to that package region 14, byrespective second lead connecting portions 52 b.

Moreover, the second lead section 26 b in one package region 14 isconnected to the first lead section 26 a in another package region 14rightward adjacent to that package region 14, by a package regionconnecting portion 54. Besides, the first lead section 26 a in onepackage region 14 is connected to the second lead section 26 b in yetanother package region 14 leftward adjacent to that package region 14,by another package region connecting portion 54.

Even when each package region 14 thus includes one die pad, 25, and onepair of lead sections, 26 a and 26 b, the present embodiment preventsthe lead frame 10 from being formed into a vertically slit blind/screenor interdigitated shape, and thus from becoming deformed duringhandling.

Modification 1-4

FIG. 13 shows a lead frame 10D according to a further modification(modification 1-4) of the present embodiment. Unlike that ofmodification 1-3 shown in FIG. 12, the lead frame 10D shown in FIG. 13does not include a die pad connecting portion 53 that connects any diepads 25.

In other words, the die pad 25 in one package region 14 is connected tothe first lead section 26 a in another package region 14 (first packageregion) upward adjacent to that package region 14, by a first inclinedreinforcement piece 51 a, and is connected to the second lead section 26b in yet another package region 14 (second package region) downwardadjacent to that package region 14, by a second inclined reinforcementpiece 51 b. The die pad 25 in one package region 14, however, is notdirectly connected to the die pads 25 in other package regions 14 (firstpackage region and second package region) upward or downward adjacent tothat package region 14.

Not providing a die pad connecting portion 53 in this way allows thedicing load upon the blade 38 to be alleviated. Other structuralfeatures and characteristics are substantially the same as those ofmodification 1-3 shown in FIG. 12.

Modification 1-5

FIG. 14 shows a lead frame 10E according to a further modification(modification 1-5) of the present embodiment. Unlike that ofmodification 1-3 shown in FIG. 12, the lead frame 10E shown in FIG. 14includes die pads 25 to each of which a first inclined reinforcementpiece 51 a and a second inclined reinforcement piece 51 b are bothconnected, and die pads 25 to which neither a first inclinedreinforcement piece 51 a nor a second inclined reinforcement piece 51 bis connected. The two types of die pads 25 are each provided atalternate positions in a longitudinal direction.

Referring to FIG. 14, neither a first inclined reinforcement piece 51 anor a second inclined reinforcement piece 51 b is connected to, forexample, the die pad 25 in a package region 14(14 b). As opposed tothis, a first inclined reinforcement piece 51 a and a second inclinedreinforcement piece 51 b are both connected to, for example, a packageregion 14(14 a) upward adjacent to the package region 14(14 b) and apackage region 14(14 c) downward adjacent to the package region 14(14b), respectively.

Reducing the number of first inclined reinforcement pieces 51 a andsecond inclined reinforcement pieces 51 b in this way allows the dicingload upon the blade 38 to be alleviated. Other structural features andcharacteristics are substantially the same as those of modification 1-3shown in FIG. 12.

Modification 1-6

FIG. 15 shows a lead frame 10F according to a further modification(modification 1-6) of the present embodiment. Unlike that of theembodiment shown in FIGS. 1 to 9, the lead frame 10F shown in FIG. 15includes neither a die pad connecting portion 53 nor a lead connectingportion 52.

In this case, the die pad 25 in one package region 14 and the leadsection 26 in a package region 14 upward adjacent to that package region14 are connected to each other by a first inclined reinforcement piece51 a. In addition, the lead section 26 in one package region 14 and thedie pad 25 in a package region 14 upward adjacent to the particularpackage region 14 are connected to each other by a second inclinedreinforcement piece 51 b. The first inclined reinforcement piece 51 aand the second inclined reinforcement piece 51 b are both positioned ina dicing region 15. In addition, the first inclined reinforcement piece51 a and the second inclined reinforcement piece 51 b intersect witheach other to form a shape of the letter X.

Furthermore, the die pad 25 in one package region 14 and the leadsection 26 in a package region 14 downward adjacent to that packageregion 14 are connected to each other by a second inclined reinforcementpiece 51 b. Moreover, the lead section 26 in one package region 14 andthe die pad 25 in a package region 14 downward adjacent to theparticular package region 14 are connected to each other by a firstinclined reinforcement piece 51 a.

Not providing a die pad connecting portion 53 or a lead connectingportion 52 in this way allows the dicing load upon the blade 38 to bealleviated. Other structural features and characteristics aresubstantially the same as those of modification 1-3 shown in FIGS. 1 to9.

Modification 1-7

FIG. 16 shows a lead frame 10G according to a further modification(modification 1-7) of the present embodiment. Unlike that ofmodification 1-6 shown in FIG. 15, the lead frame 10G shown in FIG. 16does not include package region connecting portions 54.

In this case, the die pad 25 in one package region is connected to thelead sections 26 in diagonally right upward and diagonally rightdownward package regions 14 adjacent to the die pad 25 in that packageregion, by one pair of additional inclined reinforcement pieces 55 a, 55b positioned in a dicing region. In other words, the die pad 25 in onepackage region is connected to the lead section 26 in a diagonally rightupward package region 14 adjacent to that package region, by anadditional inclined reinforcement piece 55 a, and is connected to thelead section 26 in a diagonally right downward package region 14adjacent to the foregoing package region, by an additional inclinedreinforcement piece 55 b.

In addition, the lead section 26 in one package region 14 is connectedto the die pads 25 in diagonally left upward and diagonally leftdownward package regions 14 adjacent to the lead section 26 in thatpackage region, by one pair of additional inclined reinforcement pieces55 b, 55 a positioned in different dicing regions. In other words, thelead section 26 in one package region 14 is connected to the die pad 25in a diagonally left upward package region 14 adjacent to that packageregion, by an additional inclined reinforcement piece 55 b, and isconnected to the lead section 26 in a diagonally left downward packageregion 14 adjacent to the foregoing package region, by an additionalinclined reinforcement piece 55 a. Other structural features andcharacteristics are substantially the same as those of modification 1-6shown in FIG. 15.

Modification 1-8

FIG. 17 shows a lead frame 10H according to a further modification(modification 1-8) of the present embodiment. Unlike those ofmodification 1-7 shown in FIG. 16, package regions 14 in the lead frame10H shown in FIG. 17, each include one die pad 25 and one pair of leadsections positioned across the die pad 25, namely 26 a and 26 b(hereinafter, these lead sections are also referred to as first leadsection 26 a and second lead section 26 b).

In this case, the die pad 25 in one package region 14 and the first leadsection 26 a in a package region 14 upward adjacent to that packageregion 14 are connected to each other by a first inclined reinforcementpiece 51 a positioned in a dicing region 15. Similarly, the die pad 25in one package region 14 and the first lead section 26 a in a packageregion 14 downward adjacent to that package region 14 are connected toeach other by a second inclined reinforcement piece 51 b positioned inthe dicing region 15.

In addition, the die pad 25 in one package region 14 and the second leadsection 26 b in a package region 14 upward adjacent to that packageregion 14 are connected to each other by a third inclined reinforcementpiece 51 c positioned in the dicing region 15. Similarly, the die pad 25in one package region 14 and the second lead section 26 b in a packageregion 14 downward adjacent to that package region 14 are connected toeach other by a fourth inclined reinforcement piece 51 d positioned inthe dicing region 15.

The first lead section 26 a in one package region 14 is connected to thesecond lead section 26 b in diagonally left upward and diagonally leftdownward package regions 14 adjacent to the first lead section 26 a inthat package region, by one pair of additional inclined reinforcementpieces 55 b, 55 a positioned in another dicing region 15. Moreover, thefirst lead section 26 a in one package region 14 is connected to the diepads 25 in upward and downward package regions 14 adjacent to thatpackage region, by a second inclined reinforcement piece 51 b and afirst inclined reinforcement piece 51 a, respectively.

The second lead section 26 b in one package region 14 is connected tothe first lead sections 26 a in diagonally right upward and diagonallyright downward package regions 14 adjacent to the second lead section 26b in that package region, by one pair of additional inclinedreinforcement pieces 55 b, 55 a positioned in different dicing regions.Besides, the second lead section 26 b in one package region 14 isconnected to the die pads 25 in upward and downward package regions 14adjacent to that package region, by a fourth inclined reinforcementpiece 51 d and a third inclined reinforcement piece 51 c, respectively.

For the above reasons, the lead frames according to modifications 1-1 to1-8 shown in FIGS. 10 to 17, respectively, yield substantially the sameadvantageous effects as those of the embodiment shown in FIGS. 1 to 9.

Modifications of the Semiconductor Device

Next, examples of modification, as modifications A to C, of thesemiconductor device according to the present embodiment are describedbelow referring to FIGS. 18 to 20. FIGS. 18 to 20 are sectional viewsshowing the modifications of the semiconductor device, the sectionalviews each corresponding to FIG. 4. In FIGS. 18 to 20, the same elementsas those shown in FIGS. 4 and 5 are each assigned the same referencenumber or symbol, and detailed description of these elements is omittedherein.

Modification A

FIG. 18 shows a semiconductor device 20A according to one modification(three-pin type) of the present embodiment. A lead frame 10 in thesemiconductor device 20A shown in FIG. 18 includes one die pad 25 andone pair of lead sections positioned across the die pad 25, namely 26 aand 26 b (hereinafter, these lead sections are also referred to as firstlead section 26 a and second lead section 26 b).

In addition, an LED element 21 includes one pair of terminal sections 21a, one of the paired terminal sections 21 a being connected to the firstlead section 26 a via a bonding wire 22 and the other terminal section21 a being connected to the second lead section 26 b via another bondingwire 22. The lead frame 10 in this case can be, for example, any one ofthe lead frames 10C, 10D, 10E, and 10H shown in FIGS. 12, 13, 14, and17, respectively. Other structural features and characteristics aresubstantially the same as those of the semiconductor device shown inFIGS. 4 and 5.

Modification B

FIG. 19 shows a semiconductor device 20B according to anothermodification (lens-fitted batch-molded type) of the present embodiment.In the semiconductor device 20B of FIG. 19, a reflecting resin 23 isplaced between a die pad 25 and a lead section 26. Unlike that of thesemiconductor device 20 shown in FIGS. 4 and 5, however, the reflectingresin 23 is not provided on a lead frame 10.

Additionally, in FIG. 19, an LED element 21 is connected to a lead frame10 via solder balls (electroconductive portions) 41 a and 41 b, insteadof a bonding wire 22. That is to say, one of the solder balls 41 a, 41 bis connected to the die pad 25 and the other solder ball is connected tothe lead section 26. Furthermore, in FIG. 19, a dome-shaped lens 61 isformed on an upper surface of a sealing resin 24, to control anirradiating direction of light from the LED element 21.

Modification C

FIG. 20 shows a semiconductor device 20C according to yet anothermodification (batch-molded type) of the present embodiment. In thesemiconductor device 20C of FIG. 20, an LED element 21 and a bondingwire 22 are simultaneously sealed together by a sealing resin 24 only,without using the reflecting resin 23. The sealing resin 24 is alsoplaced between a die pad 25 and a lead section 26, to fill a spatial gaptherebetween.

Second Embodiment

Next, a second embodiment of the present invention is described belowreferring to FIGS. 21 to 41. FIGS. 21 to 41 show the second embodimentof the present invention. In FIGS. 21 to 41, the same elements as thoseof the first embodiment are each assigned the same reference number orsymbol, and detailed description of these elements is omitted herein.

Lead Frame Configuration

First, a lead frame for mounting LED elements, according to the presentembodiment, is outlined below per FIGS. 21 to 23. FIG. 21 is an overallplan view of the lead frame according to the present embodiment, FIG. 22is an enlarged view of section D shown in FIG. 21, and FIG. 23 is asectional view taken along line E-E in FIG. 22.

The lead frame 70 shown in FIGS. 21 to 23 is used to fabricatesemiconductor devices 80 each having an LED element 21 mountedthereupon, one of the semiconductor devices 80 being shown in FIGS. 24and 25. The lead frame 70 includes a frame body region 13 having anoutline of a rectangular shape, and a large number of package regions 14arranged in multiple rows and columns (i.e., in matrix form) inside theframe body region 13.

As shown in FIG. 22, the package regions 14 each include a die pad 25 onwhich an LED element 21 is to be mounted, and a lead section 26 adjacentto the die pad 25. The package regions 14 are also connected to oneanother via dicing regions 15.

A spatial gap is formed between the die pad 25 and lead section 26 inone package region 14, and the lead frame 70 is constructed so that thedie pad 25 and the lead section 26 are electrically insulated from oneanother after dicing of the lead frame. Each package region 14 isprovided for an independent semiconductor device 80. Each package region14 is shown with a double-dotted line in FIG. 22.

The dicing regions 15 each extend in both longitudinal and lateraldirections between the package regions 14. As will be detailed laterherein, each dicing region 15 serves as a region through which blades 38are to pass during manufacture of the semiconductor devices 80 when thelead frame 70 is separated for each package region 14. Each packageregion 14 is shown in hatched or shaded form in FIG. 22.

As shown in FIG. 22, the lead section 26 in one package region 14 andthe lead sections 26 in other package regions 14 upward and downwardadjacent to that package region 14 are interconnected across dicingregions 15 by respective lead connecting portions 52. Further, the diepad 25 in one package region 14 and the die pads 25 in other packageregions 14 upward and downward adjacent to that package region 14 arealso interconnected across the same dicing regions 15 as above, byrespective die pad connecting portions 53. The lead connecting portions52 and the die pad connecting portions 53 are each arranged in parallelto a Y direction in FIG. 22.

In addition, each die pad connecting portion 53 and each lead connectingportion 52 are connected to each other by a reinforcement piece 57positioned in one dicing region 15. In this case, the reinforcementpiece 57 is disposed in parallel to an X direction as shown in FIG. 22,and extends rectilinearly over entire inside length of the frame bodyregion 13, thus connecting a plurality of die pad connecting portions 53and a plurality of lead connecting portions 52.

Furthermore, the die pad 25 in one package region 14 is connected to thelead section 26 in another package region 14 rightward adjacent to thatpackage region, by a package region connecting portion 54. Moreover, thelead section 26 in one package region 14 is connected to the die pad 25in another package regions 14 leftward adjacent to the particularpackage region 14, by a package region connecting portion 54. Eachpackage region connecting portion 54 is disposed in parallel withrespect to the X-direction.

The lead sections 26 and die pads 25 in outermost package regions 14 areeach connected to the frame body region 13 by one of a lead connectingportion 52, a die pad connecting portion 53, and a package regionconnecting portion 54, or a plurality of the three elements.

Referring to FIGS. 21 to 23, a lead frame main body 11 of the lead frameand a plated layer 12 are substantially of the same configuration as inthe first embodiment, and detailed description of the lead frame body 11and plated layer 12 is therefore omitted herein.

Semiconductor Device Configuration

Next, a second embodiment of a semiconductor device fabricated using thelead frame shown in FIGS. 21 to 23 is described below per FIGS. 24 and25. FIG. 24 is a sectional view of the semiconductor device (SON type),and FIG. 25 is a plan view thereof.

As shown in FIGS. 24 and 25, the semiconductor device 80 includes a(singulated) lead frame 70, an LED element 21 rested on a die pad 25 ofthe lead frame 70, and a bonding wire (electric conductor) 22 thatelectrically interconnects the LED element 21 and a lead section 26 ofthe lead frame 70.

In addition, a reflecting resin 23 with a recess 23 a is provided aroundthe LED element 21. The reflecting resin 23 is integrated with the leadframe 70. Furthermore, the LED element and the bonding wire 22 are bothsealed with a light-transmissive sealing resin 24. The recess 23 a inthe reflecting resin 23 is filled with the sealing resin 24.

Configurations of the LED element 21, bonding wire 22, reflecting resin23, and sealing resin 24 constituting the thus-configured semiconductordevice 80 are also substantially the same as in the first embodiment, sodescription of these constituent elements is omitted herein.

Method of Manufacturing the LED Element Mounting Lead Frame and theSemiconductor Device

Next, a method of manufacturing the lead frame 70 shown in FIGS. 21 to23, and the semiconductor device 80 shown in FIGS. 24 and 25, isdescribed below using FIGS. 26 to 29. The manufacturing method shown inFIGS. 26 to 28 is substantially the same as that shown in FIGS. 6 to 8,and description of a part of the manufacturing method is thereforeomitted herein.

First, a metallic substrate 31 of a flat-plate shape is provided asshown in FIG. 26(a). Next as shown in FIG. 26(b), entire upper and lowersurfaces of the metallic substrate 31 are coated with photosensitiveresists 32 a and 33 a, respectively, and then the resists are dried.

Following the above, light exposure of the metallic substrate 31 via aphotomask takes place, and developing further follows. Etching resistlayers 32 and 33 with desired openings 32 b and 33 b, respectively, arethen formed as shown in FIG. 26(c). Next as shown in FIG. 26(d), etchingof the metallic substrate 31 with an etchant occurs using the etchingresist layers 32, 33 as anti-etching films.

After that, the etching resist layers 32, 33 are peeled off, whereby alead frame body 11 is then obtained as shown in FIG. 26(e). At thistime, the reinforcement pieces 57, lead connecting portions 52, die padconnecting portions 53, and package region connecting portions 54 shownin FIG. 22 are also formed as a result of etching.

Next, upper and lower surfaces of the lead frame body 11 are providedwith electrolytic plating to deposit a metal (silver) onto the leadframe body 11 and form a plated layer 12 on the upper and lower surfacesof the lead frame body 11. This state is shown in FIG. 26(f). In thiscase, since the reinforcement pieces 57, the lead connecting portions52, the die pad connecting portions 53, and the package regionconnecting portions 54 all include the main body (the lead frame body11) and the plated layer 12 formed on the body, the reinforcement pieces57, the lead connecting portions 52, the die pad connecting portions 53,and the package region connecting portions 54 are enhanced in strength.

In this manner, the lead frame 70 that was shown in FIGS. 21 to 23 isobtained. FIG. 26(f) shows the thus-fabricated state of the lead frame70.

After this, the thus-obtained lead frame 70 shown in FIG. 27(a) ismounted in a mold 35 of an injection molding machine or transfer moldingmachine (not shown), as shown in FIG. 27(b). Next, a thermoplastic resinis poured into the mold 35 and cured. This forms the reflecting resin 23on the plated layer 12 of the lead frame 70, as shown in FIG. 27(c).

The lead frame 70 with the reflecting resin 23 formed therein is removedfrom the mold 35. A resin-containing lead frame is thus obtained, asshown in FIG. 27(d). In this way, the present embodiment also provides aresin-containing lead frame 90 that includes the lead frame 10 and thereflecting resin 23 disposed on edges of each package region 14 in thelead frame 10.

Next as shown in FIG. 28(a), an LED element 21 is mounted on the die pad25 of the lead frame 70, in each reflecting resin 23 of theresin-containing lead frame 90.

Next as shown in FIG. 28(b), the LED element 21 and the lead section 26are electrically interconnected at a terminal section 21 a of the formerand an upper surface of the latter via a bonding wire 22.

After this, the recess 23 a in the reflecting resin 23 is filled with asealing resin 24, whereby the LED element 21 and the bonding wire 22 arethen sealed with the sealing resin 24. This state is shown in FIG.28(c).

Next as shown in FIG. 28(d), the reflecting resin 23 and the lead frame70 are separated for each LED element 21 by cutting those sections ofthe dicing region 15 that correspond to the reflecting resin 23 and thelead frame 70. At this time, the lead frame 10 is first rested on andfixed to a dicing tape 37, and then each reinforcement piece 57, leadconnecting portion 52, die pad connecting portion 53, and package regionconnecting portion 54 of the lead frame 70, in addition to thereflecting resin 23 between the LED elements 21, are cut using, forexample, a blade 38 made of a diamond grinding wheel or the like.

During the cutting step, as shown in FIG. 29(a), the lead frame 70 maybe cut using a relatively thick blade 38 appropriate for particularwidth of the dicing region 15. More specifically, the reinforcementpiece 57 of the lead frame 70 and the lead connecting portion 52 and diepad connecting portion 53 positioned around the reinforcement piece 57may be collectively cut by moving the blade 38 along the reinforcementpiece 57. In this case, adjacent package regions 14 can be efficientlyseparated from each other in one cutting operation.

As an alternative, the lead frame 70 may be cut in two cuttingoperations using a relatively thin blade 38 narrower than the width ofthe dicing region 15, as shown in FIG. 29(b). More specifically, thereinforcement piece 57 of the lead frame 70 may be cut indirectly andonly the lead connecting portions 52 and die pad connecting portions 53positioned around the reinforcement piece 57 may be cut directly, bymoving the blade 38 in parallel with respect to the reinforcement piece57. In this case, the blade 38 can be increased in feed rate per cuttingoperation and extended in life.

In this way, the semiconductor device 80 shown in FIGS. 24 and 25 can beobtained. FIG. 28(e) shows the thus-fabricated state of thesemiconductor device 80.

As described above, in accordance with the present embodiment, one diepad connecting portion 53 and one lead connecting portion 52 areconnected to each other by the reinforcement piece 57 positioned in onedicing region 15. In addition, the die pad 25 in one package region 14is connected to the lead section 26 in another package region 14adjacent to that package region 14, by a package region connectingportion 54. These structural features and characteristics prevent anelongated space from occurring in a vertical direction of the lead frame70, and hence prevent the lead frame 70 from being formed into avertically slit blind/screen or interdigitated shape, and from becomingdeformed during handling.

Furthermore, the lead section 26 in one package region 14 is connectedto the lead section 26 in another package region 14 adjacent to thatpackage region 14, by a lead connecting portion 52, and the die pad 25in one package region 14 is connected to the die pad 25 in anotherpackage region 14 adjacent to that package region 14, by a die padconnecting portion 53. These structural features and characteristicsprevent an elongated space from occurring in a horizontal direction ofthe lead frame 70, and hence prevent the lead frame 70 from being formedinto a horizontally slit blind/screen or interdigitated shape, and frombecoming deformed during handling.

The deformation of the lead frame 70 is thus prevented, so when thereflecting resin 23 is formed in the lead frame 70 as shown in FIGS.27(b) and 27(c), a forming position of the reflecting resin 23 withrespect to the lead frame 70 does not shift. It is therefore easy tomount a large-area LED element 21 in a small package region 14, to mounta plurality of LED elements 21, or to mount an antistatic protectionelement in addition to an LED element 21.

Additionally, since the present embodiment makes it unnecessary toprovide tie bars of a matrix format around any package regions 14,package regions 14 can be arranged in proximity to one another, andhence the number of package regions 14 in one lead frame 70 can beincreased by higher-density mounting.

Furthermore, since a connecting bar such as a hanging lead is absent atany corners of a package region 14 in the present embodiment, peeling ofthe reflecting resin 23 from the lead frame 70, at corners of thesemiconductor device 80, is unlikely and thus, reliability of thesemiconductor device 80 improves.

Modifications of the Lead Frame

Hereunder, various examples of modification, as modifications 2-1 to2-6, of the lead frame according to the present embodiment are describedreferring to FIGS. 30 to 35. FIGS. 30 to 35 are partly enlarged planviews showing the modifications of the lead frame, the plan views eachcorresponding to FIG. 2. In FIGS. 30 to 35, the same elements as thoseshown in FIGS. 21 to 29 are each assigned the same reference number orsymbol, and detailed description of these elements is omitted herein.

Modification 2-1

FIG. 30 shows a lead frame 70A according to one modification(modification 2-1) of the present embodiment. Unlike those of theembodiment shown in FIGS. 21 to 29, package regions 14 in the lead frame70A shown in FIG. 30, each include one die pad 25 and one pair of leadsections positioned across the die pad 25, namely 26 a and 26 b(hereinafter, these lead sections are also referred to as first leadsection 26 a and second lead section 26 b; and this kind of lead frameis called a three-pin type).

In this case, the first lead section 26 a in one package region 14 andthe first lead sections 26 a in other package regions 14 upward anddownward adjacent to that package region 14 are interconnected acrossdicing regions 15 by respective first lead connecting portions 52 a. Thesecond lead section 26 b in one package region 14 and the second leadsections 26 b in other package regions 14 upward and downward adjacentto that package region 14 are also interconnected across dicing regions15 by respective second lead connecting portions 52 b.

Additionally, the die pad 25 in one package region 14 and the die pads25 in other package regions 14 upward and downward adjacent to thatpackage region 14 are interconnected across dicing regions 15 byrespective die pad connecting portions 53. Furthermore, one die padconnecting portion 53, one first lead connecting portion 52 a, and onesecond lead connecting portion 52 b are connected to each other by areinforcement piece 57 positioned in a dicing region 15. In this case,the reinforcement piece 57 extends rectilinearly over entire insidelength of the frame body region 13 and connects a plurality of die padconnecting portions 53, a plurality of first lead connecting portions 52a and a plurality of second lead connecting portions 52 b.

Furthermore, the second lead section 26 b in one package region 14 isconnected to the first lead section 26 a in another package region 14rightward adjacent to that package region, by a package regionconnecting portion 54. Moreover, the first lead section 26 a in onepackage region 14 is connected to the second lead section 26 b inanother package regions 14 leftward adjacent to the particular packageregion 14, by a package region connecting portion 54.

Even when each package region 14 thus includes a die pad 25 and one pairof lead sections, 26 a and 26 b, the provision of reinforcement pieces57 prevents an elongated space from occurring in a vertical direction ofthe lead frame 70A, and hence prevents the lead frame 70A from beingformed into a vertically slit blind/screen or interdigitated shape, andfrom becoming deformed during handling.

Modification 2-2

FIG. 31 shows a lead frame 70B according to another modification(modification 2-2) of the present embodiment. The lead frame 70B shownin FIG. 31 differs from the embodiment of FIGS. 21 to 29 at least inthat of a plurality of dicing regions 15 extending in a lateraldirection, those with a reinforcement piece 57, and those without areinforcement piece 57 are arranged at alternate positions in alongitudinal direction.

That is to say, let a package region 14(14 a) upward adjacent to apackage region 14(14 b) in FIG. 31 be a first package region 14 a, andlet a package region 14(14 c) downward adjacent to the package region14(14 b) be a second package region 14 c.

In this case, a die pad connecting portion 53 that connects the die pad25 in the package region 14 b and that of the first package region 14 a,and a lead connecting portion 52 that connects the lead section 26 inthe package region 14 b and that of the first package region 14 a areboth connected to each other by a reinforcement piece 57 positioned on adicing region 15. On the other hand, neither a die pad connectingportion 53 that connects the die pad 25 in the package region 14 b andthat of the second package region 14 c, nor a lead connecting portion 52that connects the lead section 26 in the package region 14 b and that ofthe second package region 14 c are connected to each other by areinforcement piece 57.

Reducing the number of reinforcement pieces 57 in this way allows adicing load upon a blade 38 to be alleviated. Other structural featuresand characteristics are substantially the same as those of theembodiment shown in FIGS. 21 to 29.

Among the plurality of dicing regions 15 that extend in the lateraldirection, those without a reinforcement piece 57 are preferablynarrowed to width (W_(a)) smaller than width (W_(b)) of the dicingregions each having a reinforcement piece 57, that is, W_(a)<W_(b) ispreferable. In this case, the number of package regions 14 in one leadframe 70 can be increased. In addition, to cut dicing regions 15 using arelatively thin blade 38, as in FIG. 29(b), the number of cuttingoperations can be reduced since the dicing regions 15 without areinforcement piece 57 can each be cut in one cutting operation.

Modification 2-3

FIG. 32 shows a lead frame 70C according to yet another modification(modification 2-3) of the present embodiment. The lead frame 70C shownin FIG. 32 is a combination of modification 2-1 shown in FIG. 30 andmodification 2-2 shown in FIG. 31.

Package regions 14 in FIG. 32 each include one die pad 25 and one pairof lead sections positioned across the die pad 25, namely 26 a and 26 b(hereinafter, these lead sections are also referred to as first leadsection 26 a and second lead section 26 b; and this kind of lead frameis called a three-pin type).

Among a plurality of dicing regions 15 extending in a lateral directionin FIG. 32, those with a reinforcement piece 57, and those without areinforcement piece 57 exist at alternate positions in a longitudinaldirection.

In other words, in FIG. 32, a die pad connecting portion 53 thatconnects the die pad 25 in one package region 14(14 b) and that of asecond package region 14(14 b) upward adjacent to the particular packageregion 14(14 b), a first lead connecting portion 52 a that connects thelead section 26 a in the package region 14(14 b) and that of the secondpackage region 14(14 a), and a second lead connecting portion 52 b thatconnects the lead section 26 b in the package region 14(14 b) and thatof the second package region 14(14 b) are connected to each other by areinforcement piece 57 positioned on a dicing region 15.

On the other hand, neither a die pad connecting portion 53 that connectsthe die pad 25 in one package region 14(14 b) and that of a secondpackage region 14(14 c) downward adjacent to the particular packageregion 14(14 b), a first lead connecting portion 52 a that connects thelead section 26 a in the package region 14(14 b) and that of the secondpackage region 14(14 c) downward adjacent to the particular packageregion 14(14 b), nor a second lead connecting portion 52 b that connectsthe lead section 26 b in the package region 14(14 b) and that of thesecond package region 14(14 c) downward adjacent to the particularpackage region 14(14 b) are connected to each other by a reinforcementpiece 57.

Other structural features and characteristics are substantially the sameas those of modifications 2-1 and 2-2 shown in FIGS. 30 and 31,respectively.

Modification 2-4

FIG. 33 shows a lead frame 70D according to a further modification(modification 2-4) of the present embodiment. Unlike those of theembodiment shown in FIGS. 21 to 29, reinforcement pieces 57 of the leadframe 70D shown in FIG. 33, each extend only between the die padconnecting portion 53 and lead connecting portion 52 connected to thedie pad 25 and lead section 26, respectively, in each package region 14,and connect the die pad connecting portion 53 and the lead connectingportion 52.

In other words, the die pad 25 and lead section 26 in one package region14 are connected to the die pad 25 and lead section 26 in anotherpackage region 14 upward (or downward) adjacent to that package region14, by a die pad connecting portion 53 and a lead connecting portion 52,respectively. In this case, a reinforcement piece 57 extends onlybetween the lead connecting portion 52 and the die pad connectingportion 53, and connects both thereof. The reinforcement piece 57, onthe other hand, does not extend to a left edge of the lead connectingportion 52 or a right edge of the die pad connecting portion 53.

Reducing overall length of the reinforcement piece 57 in one dicingregion 15 in this way allows a dicing load upon a blade 38 to bealleviated. Other structural features and characteristics aresubstantially the same as those of the embodiment shown in FIGS. 21 to29.

Modification 2-5

FIG. 34 shows a lead frame 70E according to a further modification(modification 2-5) of the present embodiment. The lead frame 70E shownin FIG. 34 is a combination of modification 2-1 shown in FIG. 30 andmodification 2-4 shown in FIG. 33.

Package regions 14 in FIG. 34 each include one die pad 25 and one pairof lead sections positioned across the die pad 25, namely 26 a and 26 b(hereinafter, these lead sections are also referred to as first leadsection 26 a and second lead section 26 b; and this kind of lead frameis called a three-pin type).

Referring also to FIG. 34, reinforcement pieces 57 each extend onlybetween the first lead connecting portion 52 a, die pad connectingportion 53, and second lead connecting portion 52 b connected to the diepad 25 and lead sections 26 a, 26 b, respectively, in each packageregion 14, and connect the first lead connecting portion 52 a, the diepad connecting portion 53, and the second lead connecting portion 52 b.

Reducing overall length of the reinforcement piece 57 in one dicingregion 15 in this way allows a dicing load upon a blade 38 to bealleviated. Other structural features and characteristics aresubstantially the same as those of modifications 2-1 and 2-4 shown inFIGS. 30 and 33, respectively.

Modification 2-6

FIG. 35 shows a lead frame 70F according to a further modification(modification 2-6) of the present embodiment. Package regions 14 in thelead frame 70F shown in FIG. 35, each include one die pad 25 and onepair of lead sections positioned across the die pad 25, namely 26 a and26 b (hereinafter, these lead sections are also referred to as firstlead section 26 a and second lead section 26 b; and this kind of leadframe is called a three-pin type).

The die pad 25, first lead section 26 a, and second lead section 26 b inone package region 14 are connected to the die pads 25, first leadsections 26 a, and second lead sections 26 b in other package regions 14upward and downward adjacent to that package region, by a die padconnecting portion 53, a first lead connecting portion 52 a, and asecond lead connecting portion 52 b, respectively.

As shown in FIG. 35, a reinforcement piece 57 that connects only a diepad connecting portion 53 and a first lead connecting portion 52 a, anda reinforcement piece 57 that connects only a die pad connecting portion53 and a second lead connecting portion 52 b are provided at alternatepositions in a longitudinal direction.

That is to say, let a package region 14(14 a) upward adjacent to apackage region 14(14 b) in FIG. 35 be a first package region 14 a, andlet a package region 14(14 c) downward adjacent to the package region14(14 b) be a second package region 14 c.

In this case, in a dicing region 15 between the package region 14 b andthe first package region 14 a, the reinforcement piece 57 extends onlybetween the die pad connecting portion 53 and the first lead connectingportion 52 a, and connects only the die pad connecting portion 53 andthe first lead connecting portion 52 a.

In a dicing region 15 between the package region 14 b and the secondpackage region 14 c, on the other hand, the reinforcement piece 57extends only between the die pad connecting portion 53 and the secondlead connecting portion 52 b, and connects only the die pad connectingportion 53 and the second lead connecting portion 52 b.

Reducing the number of reinforcement pieces 57 in this way allows adicing load upon a blade 38 to be alleviated. Other structural featuresand characteristics are substantially the same as those of modification2-5 shown in FIG. 34.

The reinforcement pieces in the present embodiment can also be appliedto other examples of a lead frame. These examples include, but are notlimited to, the following. One is a four-pin type of embodiment, whichincludes in individual package regions 14, as with a lead frame 70G(modification 2-7) shown in FIG. 36, two die pads, 25 a and 25 b(hereinafter, also referred to as first die pad 25 a and second die pad25 b), and one pair of lead sections, 26 a and 26 b (also referred to asfirst lead section 26 a and second lead section 26 b), positionedadjacently to either side of the die pads 25 a, 25 b. One is anotherfour-pin type of embodiment, which includes in individual packageregions 14, as with a lead frame 70H (modification 2-8) shown in FIG.38, one die pad, 25, one pair of lead sections, 26 a and 26 b(hereinafter, also referred to as first lead section 26 a and secondlead section 26 b), positioned adjacently to one side of the die pad 25,and one lead section, 26 c, positioned adjacently to the other side ofthe die pad 25.

Problems common to these examples are the followings. Since the die pads25 (25 a, 25 b) and lead sections 26 (26 a, 26 b, 26 c) in each packageregion 14 are arranged linearly in one row, if arrangement of the leadconnecting portions 52 and die pad connecting portions 53 that connectpackage regions 14 is attempted to prevent short-circuiting between thedie pads 25 and the lead sections 26, then this makes it likely to formspatial gaps connected between the die pads 25 and the lead sections 26,thus causing a plurality of elongated spaces parallel to one side of thelead frame 70, and hence structurally deforming the lead frame 70. Theseproblems, however, as already described, can be effectively solved byusing the reinforcement pieces 57 of the present embodiment. Inmodifications 2-7 to 2-10 described below (see FIGS. 36 to 41), the sameelements as in the embodiment shown in FIGS. 21 to 29 are also eachassigned the same reference number or symbol, and detailed descriptionof these elements is omitted herein.

Modification 2-7

FIG. 36 shows the lead frame 70G according to modification 2-7 of thepresent embodiment. Unlike those of the embodiment shown in FIGS. 21 to29, each package region 14 of the lead frame 70G shown in FIG. 36includes two die pads, 25 a and 25 b (hereinafter, also referred to asfirst die pad 25 a and second die pad 25 b), and one pair of leadsections, 26 a and 26 b (also referred to as first lead section 26 a andsecond lead section 26 b), positioned adjacently to either side of thedie pads 25 a, 25 b. By using such a lead frame 70G, a semiconductordevice 80 in which two LED elements 21 are stored within one package canbe realized, as shown in FIG. 37.

In modification 2-7, the first lead section 26 a in one package region14 and the first lead sections 26 a in other package regions 14 upwardand downward adjacent to that package region 14 are interconnectedacross dicing regions 15 by respective first lead connecting portions 52a. The second lead section 26 b in one package region 14 and the secondlead sections 26 b in other package regions 14 upward and downwardadjacent to that package region 14 are also interconnected across dicingregions 15 by respective second lead connecting portions 52 b.

In addition, the first die pad 25 a and second die pad 25 b in onepackage region 14 are connected to the corresponding die pads 25 a and25 b in other package regions 14 upward and downward adjacent to thatpackage region 14, across dicing regions 15 by a first die padconnecting portion 53 a and a second die pad connecting portion 53 b,respectively. Furthermore, each first die pad connecting portion 53 a,second die pad connecting portion 53 b, first lead connecting portion 52a, and second lead connecting portion 52 b are connected to each otherby a reinforcement piece 57 positioned in a dicing region 15. In thiscase, the reinforcement piece 57 extends rectilinearly over entireinside length of the frame body region 13 and connects a plurality offirst die pad connecting portions 53 a, a plurality of second die padconnecting portions 53 b, a plurality of first lead connecting portions52 a, and a plurality of second lead connecting portions 52 b.

Among the plurality of dicing regions 15 extending in a lateraldirection in the lead frame 70G shown in FIG. 36, those with areinforcement piece 57 and those without a reinforcement piece 57 arearranged at alternate positions in a longitudinal direction.

Even when each package region 14 thus includes two die pads, 25 a and 25b, and one pair of lead sections, 26 a and 26 b, the provision ofreinforcement pieces 57 prevents an elongated space from occurring in avertical direction of the lead frame 70G, and hence prevents the leadframe 70G from being formed into a vertically slit blind/screen orinterdigitated shape, and from becoming deformed during handling. Inaddition, dicer tooth wear can be mitigated since the reinforcementpieces 57 exist only in part of the dicing regions 15.

Modification 2-8

FIG. 38 shows the lead frame 70H according to modification 2-8 of thepresent embodiment. Each package region 14 in the lead frame 70H of FIG.38 includes a die pad 25 and one pair of lead layout regions, 16L and16R, positioned across the die pad 25. In the lead layout region 16L, alead section 26 a is disposed, and in the lead layout region 16R, twolead sections, 26 c and 26 d, are arranged in one row along the die pad25 (hereinafter, the lead sections 26 a, 26 c, 26 d are also referred toas first lead section 26 a, second lead section 26 c, and third leadsection 26 d). By using such a lead frame 70H, a semiconductor device 80in which three LED elements 21 are stored within one package can berealized, as shown in FIG. 39.

Modification 2-8 differs from modification 2-1 (FIG. 30) or modification2-3 (FIG. 32) in that the former includes the second lead sections 26 cand the third lead sections 26 d. In the lead frame 70H of FIG. 38,however, partial lead connecting portions 55 each for connecting onesecond lead section 26 c and one third lead section 26 c, are providedand each connects the second lead section 26 c and the third leadsection 26 d via a second lead connecting portion 52 c positioned in adicing region 15. The second lead connecting portion 52 c extendslongitudinally over entire inside length of the frame body region 13, ineach dicing region 15.

Between the package regions 14 in the lead frame 10H, the first leadsection 26 a in one package region 14 and the first lead sections 26 ain package regions 14 upward and downward adjacent to that packageregion 14 are interconnected across dicing regions 15 by respectivefirst lead connecting portions 52 a. The second lead section 26 c andthird lead section 26 d in one package region 14 are connected to thesecond lead sections 26 c and third lead sections 26 d, respectively, inpackage regions 14 upward and downward adjacent to that package region14, across dicing regions 15 and via partial lead connecting portions 55by second lead connecting portions 52 c. As shown in this modification,when one second lead section 26 c and one third lead section 26 d can behandled as an integrated lead via the partial lead connecting portions55, if the second lead section 26 c and third lead section 26 d to beintegrally handled (i.e. the lead layout region 16R), the die pad 25,and the first lead section 26 a are arranged rectilinearly in one line,using the reinforcement pieces 57 of the present invention prevents thelead frame from becoming deformed.

Among the plurality of dicing regions 15 extending in a lateraldirection in the lead frame 70H of FIG. 38, those with a reinforcementpiece 57 and those without a reinforcement piece 57 are arranged atalternate positions in the longitudinal direction.

Modification 2-9

FIG. 40 shows a lead frame 70I according to modification 2-9 of thepresent embodiment. The lead frame 70I shown in FIG. 40 differs frommodification 2-2 of FIG. 31 at least in that of a plurality of dicingregions 15 extending in a lateral direction, those each having areinforcement piece 57 are cyclically provided at a predetermined numberof dicing regions in a longitudinal direction. While dicing regions,each having a reinforcement piece 57, are provided every three positionsin FIG. 40, the layout of the dicing regions is not limited to this rateand they may be provided at intervals of every four or five positions,for example.

Reducing the number of reinforcement pieces 57 in this way allows adicing load upon a blade 38 to be alleviated. Other structural featuresand characteristics are substantially the same as those of modification2 shown in FIG. 31.

Modification 2-10

FIG. 41 shows a lead frame 703 according to modification 2-10 of thepresent embodiment. The lead frame 703 shown in FIG. 41 differs frommodification 2-9 of FIG. 40 at least in that of all dicing regions 15extending in a lateral direction, those each provided with areinforcement piece 57 are formed irregularly, not at fixed intervals,in a longitudinal direction.

In this case, reducing the number of reinforcement pieces 57 also allowsa dicing load upon a blade 38 to be alleviated. Other structuralfeatures and characteristics are substantially the same as those ofmodification 2-2 shown in FIG. 31.

For the above reasons, the lead frames according to modifications 2-1 to2-10 shown in FIGS. 30 to 41, respectively, yield substantially the sameadvantageous effects as those of the embodiment shown in FIGS. 21 to 29.

The type of semiconductor device fabricated using any one of the leadframes 70, 70B, 70D, 70I, and 70J shown in FIGS. 21 to 23, 31, 33, 40,and 41, respectively, is not limited to that shown in FIGS. 24 and 25,and the semiconductor device may be that shown as modification B in FIG.19, or as modification C in FIG. 20. In addition, the semiconductordevice fabricated using any one of the lead frames 70A, 70C, 70E, and70F shown in FIGS. 30, 32, 34, and 35, respectively, may be that shownas modification A in FIG. 18.

Third Embodiment

Next, a third embodiment of the present invention is described belowreferring to FIGS. 42 to 44. FIGS. 42 to 44 show the third embodiment ofthe present invention. The third embodiment shown in FIGS. 42 to 44differs from the foregoing first and second embodiments primarily inthat the LED elements 21 in the foregoing embodiments are replaced bysemiconductor elements 45 such as diodes, and other structural featuresand characteristics are substantially the same as in the first andsecond embodiments. In FIGS. 42 to 44, the same elements as those of thefirst and second embodiments are each assigned the same reference numberor symbol, and detailed description of these elements is omitted herein.

Lead Frame Configuration

FIG. 42 is a sectional view of a lead frame 60 according to the presentembodiment. The lead frame 60 according to the present embodiment is formounting diodes or other semiconductor elements 45 (see FIG. 42) insteadof LED elements 21, and includes a plated layer 12 formed only on partof lead sections 26, this part being where a bonding wire 22 isconnected. Other configurational features and characteristics are thesame as those of the embodiment shown in FIGS. 1 to 3, or of theembodiment shown in FIGS. 21 to 23.

A planar shape of the lead frame 60 in the present embodiment is notlimited to the shape of the lead frame 10 shown in FIGS. 1 to 3, or tothe shape of the lead frame 70 shown in FIGS. 21 to 23; the lead frame60 may have the shape of any one of the lead frames shown in FIGS. 10 to17, or to the shape of any one of the lead frames shown in FIGS. 30 to41.

Semiconductor Device Configuration

FIG. 43 shows a semiconductor device 65 according to the presentembodiment. The semiconductor device 65, fabricated using the lead frame60 shown in FIG. 42, includes the (singulated) lead frame 60 and asemiconductor element 45 rested on a die pad 25 of the lead frame 60.The semiconductor element 45 may include a discrete semiconductorelement such as a diode. The semiconductor element 45 also includes aterminal section 45 a, which is electrically connected to a plated layer12 provided on a lead section 26, by a bonding wire 22. Additionally,the semiconductor element 45 and the bonding wire 22 are sealed with asealing resin 24.

The sealing resin 24 can be that formed from an epoxy resin or asilicone resin. This sealing resin, however, unlike that of the firstembodiment or the second embodiment, does not always need to betransparent and can include an opaque resin of black, for example.

Method of Manufacturing the Semiconductor Device

Next, a method of manufacturing the semiconductor device 65 shown inFIG. 43 is described below using FIGS. 44(a) to 44(f). FIGS. 44(a) to44(f) show the method of manufacturing the semiconductor deviceaccording to the present embodiment.

First, the lead frame 60 is fabricated as in the steps of FIGS. 6(a) to6(f) and FIGS. 26(a) to 26(f). FIG. 44(a) shows the thus-fabricated leadframe 60. In the step of forming the plated layer 12, that is, in FIG.6(f) or 26(f), the plated layer 12 is formed only on part of a leadsection 26, not over an entire surface of a lead frame body 11.

Next, the semiconductor element 45 is mounted on a die pad 25 of thelead frame 60. In this case, the semiconductor element 45 is rested onand fixed to the die pad 25 by use of solder or a die-bonding paste, asshown in FIG. 44(b).

Next, the terminal section 45 a of the semiconductor element 45 and theplated layer 12 on the lead section 26 are electrically connected toeach other via the bonding wire 22, as shown in FIG. 44(c).

After this, the semiconductor element 45 and the bonding wire 22 aresimultaneously sealed together using the sealing resin 24, as shown inFIG. 44(d). At this time, a backing tape not shown may be attached to alower surface of the lead frame 60 to prevent the sealing resin 24 fromhanging down over a first outer lead section 27 and/or a second outerlead section 28.

Next as shown in FIG. 44(e), the sealing resin 24 and the lead frame 60are separated for each semiconductor element 45 by cutting thosesections of a dicing region 15 that correspond to the sealing resin 24and the lead frame 60. At this time, the lead frame 60 is first restedon and fixed to a dicing tape 37, and then inclined reinforcement pieces51 (or reinforcement pieces 57), lead connecting portions 52, die padconnecting portions 53, and package region connecting portions 54 of thelead frame 60, in addition to the sealing resin 24 between thesemiconductor elements 45, are cut using, for example, a blade 38 madeof a diamond grinding wheel or the like. Lead frame cutting with theblade 38 may use the method shown in FIGS. 9(a), 9(b) or FIGS. 29(a),29(b).

The semiconductor device 65 shown in FIG. 43 is thus obtained. FIG.44(e) shows the lead frame being cut.

As described above, in the present embodiment, the semiconductor element45 such as a diode is rested instead of an LED element 21, and areflecting resin 23 is not provided on the lead frame 60. In this case,in the process for manufacturing the semiconductor device 65 (FIGS.44(a) to 44(f)), since a reflecting resin 23 to be used to strengthenthe lead frame 60 is absent during the manufacturing process, a needarises to prevent deformation of the lead frame 60 shown in FIG. 44(e),at least until sealing with the sealing resin 24 has been conducted.More specifically, when the semiconductor element 45 is mounted, thelead frame 60 is, in some case, conveyed via its edge along a rail, atwhich time the need arises to prevent the deformation of the lead frame60. Additionally, since bonding of the semiconductor element 45 byeutectic bonding involves lead frame heating (e.g., for 10 minutes at400° C.), it is necessary to prevent reduction in strength of the leadframe 60 due to the heat. Furthermore, since heat and impacts are alsoapplied during wire bonding, reduction in strength of the lead frame 60due to this heat also needs to be prevented. The strength of the leadframe 60 is therefore required to be enhanced relative to that obtainedif the lead frame includes a reflecting resin 23.

In accordance with the present embodiment, on the other hand, the diepad 25 in one package region 14 and the lead section 26 in anotherpackage region 14 adjacent to that package region are connected to eachother by an inclined reinforcement piece 51 positioned in a dicingregion 15. Alternatively, a die pad connecting portion 53 and a leadconnecting portion 52 are connected to each other by a reinforcementpiece 57 positioned in the dicing region 15. These reinforcement piecesprevent an elongated space from occurring in a vertical direction of thelead frame 60, and hence prevent the lead frame 60 from being formedinto a vertically slit blind/screen or interdigitated shape, and frombecoming deformed during handling.

Besides the above, the present embodiment also yields substantially thesame operational effects as those of the first and second embodiments.

What is claimed is:
 1. A lead frame for mounting LED elements, comprising: a frame body region; and a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, wherein the die pad in one package region and the lead section in another package region adjacent to the package region of interest are connected to each other by an inclined reinforcement piece, wherein the inclined reinforcement piece is arranged so as to bridge across the package regions adjacent to each other.
 2. The lead frame according to claim 1, wherein the die pad in one package region is connected to the die pad in another package region adjacent to the package region of interest, by a die pad connecting portion.
 3. The lead frame according to claim 1, wherein: the die pad in one package region and the lead section in a first package region adjacent to the package region of interest are connected to each other by a first inclined reinforcement piece; and the die pad in one package region and the lead section in a second package region adjacent to the package region of interest are connected to each other by a reinforcement piece.
 4. The lead frame according to claim 1, wherein: the die pad in one package region and the lead section in another package region adjacent to the package region of interest are connected to each other by a first inclined reinforcement piece; and the lead section in one package region and the die pad in another package region adjacent to the package region of interest are connected to each other by a second inclined reinforcement piece.
 5. The lead frame according to claim 1, wherein the die pad in one package region is connected to the lead sections in diagonally upward and diagonally downward package regions adjacent to the die pad in the package region of interest, by one pair of additional inclined reinforcement pieces.
 6. The lead frame according to claim 1, wherein the lead section in one package region is connected to the lead sections in diagonally upward and diagonally downward package regions adjacent to the lead section in the package region of interest, by one pair of additional inclined reinforcement pieces.
 7. The lead frame according to claim 1, wherein the inclined reinforcement piece includes a main body and a plated layer formed on the main body.
 8. A resin-containing lead frame, comprising: the lead frame according to claim 1; and a reflecting resin disposed on edges of package regions in the lead frame.
 9. A method for manufacturing a semiconductor device, comprising the steps of: providing the resin-containing lead frame according to claim 8; mounting an independent LED element on each of die pads, inside the reflecting resin of the resin-containing lead frame; interconnecting the LED element and a lead section via an electric conducting portion; filling the reflecting resin of the resin-containing lead frame with a sealing resin; and separating the reflecting resin and the lead frame, for each LED element, by cutting the reflecting resin and the lead frame.
 10. A lead frame for mounting LED elements, comprising: a frame body region; and a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, wherein the lead section in at least one package region is connected to the lead section in another package region adjacent to the package region of interest, by a lead connecting portion; and wherein the lead section in one package region and the die pad in another package region adjacent to the package region of interest are connected to each other by an inclined reinforcement piece, wherein the inclined reinforcement piece is arranged so as to bridge across the package regions adjacent to each other.
 11. A lead frame for mounting semiconductor elements, comprising: a frame body region; and a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which a semiconductor element is to be mounted and a lead section adjacent to the die pad, wherein the die pad in one package region and the lead section in another package region adjacent to the package region of interest are directly connected to each other by an inclined reinforcement piece, wherein the inclined reinforcement piece is arranged so as to bridge across the package regions adjacent to each other.
 12. The lead frame according to claim 11, wherein the die pad in one package region is connected to the die pad in another package region adjacent to the package region of interest, by a die pad connecting portion.
 13. The lead frame according to claim 11, wherein: the die pad in one package region and the lead section in a first package region adjacent to the package region of interest are connected to each other by a first inclined reinforcement piece; and the die pad in one package region and the lead section in a second package region adjacent to the package region of interest are connected to each other by a reinforcement piece.
 14. The lead frame according to claim 11, wherein the die pad in one package region and the lead section in another package region adjacent to the package region of interest are connected to each other by a first inclined reinforcement piece; and the lead section in one package region and the die pad in another package region adjacent to the package region of interest are connected to each other by a second inclined reinforcement piece.
 15. The lead frame according to claim 11, wherein the die pad in one package region is connected to the lead sections in diagonally upward and diagonally downward package regions adjacent to the die pad in the package region of interest, by one pair of additional inclined reinforcement pieces.
 16. The lead frame according to claim 11, wherein the lead section in one package region is connected to the lead sections in diagonally upward and diagonally downward package regions adjacent to the lead section in the package region of interest, by one pair of additional inclined reinforcement pieces.
 17. A lead frame for mounting semiconductor elements, comprising: a frame body region; and a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which a semiconductor element is to be mounted and a lead section adjacent to the die pad, wherein the lead section in at least one package region is connected to the lead section in another package region adjacent to the package region of interest, by a lead connecting portion; and wherein the lead section in one package region and the die pad in another package region adjacent to the package region of interest are directly connected to each other by an inclined reinforcement piece, wherein the inclined reinforcement piece is arranged so as to bridge across the package regions adjacent to each other. 